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Advances in Electronic Circuit Packaging: Volume 2 by D. A. Beck (auth.), Gerald A. Walker (eds.) PDF

By D. A. Beck (auth.), Gerald A. Walker (eds.)

ISBN-10: 1489972978

ISBN-13: 9781489972972

ISBN-10: 1489973117

ISBN-13: 9781489973115

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Read or Download Advances in Electronic Circuit Packaging: Volume 2 Proceedings of the Second International Electronic Circuit Packaging Symposium, sponsored by the University of Colorado and EDN (Electrical Design News), held at Boulder, Colorado PDF

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Extra info for Advances in Electronic Circuit Packaging: Volume 2 Proceedings of the Second International Electronic Circuit Packaging Symposium, sponsored by the University of Colorado and EDN (Electrical Design News), held at Boulder, Colorado

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The center conductor was a doublecopper photo etching on epoxy filled glass laminate. The foregoing is merely a splash in the ocean of evidence showing the desirability, if not downright necessity, of using these lighter materials in this space age electronic packaging. And as a parting shot, this must be borne in mind - one may resist using these better materials, but there are some competitors who are using them. DISCUSSION Question: Jake Rubin. General Electric. Philadelphia. I would like to compliment Mr.

5). 3 Mixing of Encapsulating Compound - For best results during the subsequent deaeration step, it is recommended that the container have a diameter approximately equal to its height and a volume at least four times the volume of the mixed compound. Combine the epoxy resin and filler and mix thoroughly in a planetary-action mixer with a flat beater until the filler has been wetted and thoroughly dispersed throughout the resin. The mixing operation shall be completed in approximately 10 min to avoid excessive crushing of the filler.

The deaerated resin mix shall be used in the subsequent steps as soon as practicable. 5 Pouring of Encapsulating Compound - At the time of pouring, the encapsulating compound shall· be at a temperature of 180 to 190°F, preferably not lower than 185°F. The preheated components and mold shall be partially filled with the warm, deaerated encapsulating compound. Degas the mold and components by placing them in a vacuum chamber and evacuating at a pressure of 1-3 mm Hg absolute and maintaining this reduced pressure for at least 3 min.

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Advances in Electronic Circuit Packaging: Volume 2 Proceedings of the Second International Electronic Circuit Packaging Symposium, sponsored by the University of Colorado and EDN (Electrical Design News), held at Boulder, Colorado by D. A. Beck (auth.), Gerald A. Walker (eds.)


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